
Applications
・Polishing SUS-made press plate

Features & Benefits
P-GANGED WHEEL is abrasives for polishing SUS-made press plate. Due to high grinding ability and moderate flexibility, this wheel provides gentle cleaning action on the surface of PCB.
Applications
・Surface finishing prior to solder resist.
・Scrubbing the surface of flexible printed circuit board.
・Surface cleaning.

Features & Benefits
P-FLAP WHEEL has the moderately flexible structure, which provides gentle cleaning action on the surface of PCB.
Applications
・Deburring after drilling (before copper plating).
・Grinding prior to dry-film lamination.
・Surface finishing prior to solder resist.

Features & Benefits
PCW WHEEL has a wide variety of grit sizes and hardness levels to meet various applications. This wheel has a half-cut type (aluminum core) as well as a straight type.
Applications
・Grinding prior to dry-film lamination.
・Deburring after drilling (before copper plating)
・Surface finishing prior to solder resist.

Features & Benefits
■ Uniform surface finish without polishing variation and wild scratches.
■ Minified buff dust size prevents holes from loading.
■ Improved durability contributes to a cost reduction.
Applications
・Deburring after drilling (before copper plating)
・Grinding prior to dry-film lamination.
・Surface finishing prior to solder resist.

Features & Benefits
By employing ultra fine fibers thinly coated with resin bond realizes minifying of buff dust size and improves uniformity of abrasive coating.
This contributes to minimize clogging of holes and improve surface roughness, so that uniform surface finish without polishing variation and wild scratches can be obtained.
Applications
・Removing permanent hole plugging ink.
・Removing residual copper dust after plating.

Features & Benefits
■ Due to high grinding ability, this wheel is suitable for removing hole plugging ink.
■ Right after dressing, this wheel requires less dummy boards.
■ “Standard type” (Type1) and “Freer-cutting type” (Type3) are available.
Applications
・Removing hole plugging ink.
・Removing build-up resin.
・Removing the layer after black oxide treatment.
・Polishing SUS-made press plate

Features & Benefits
■ HSW WHEEL has a flap structure reinforced by the resin impregnation.
■ This wheel shows high grinding ability and works effectively on removing resin.
Applications
・Leveling and removing build-up resin.
・Removing permanent hole plugging ink.
・Removing prepreg resin.

Features & Benefits
■ VC WHEEL is a convolute wheel with grinding ability.
■ This wheel provides excellent leveling performance when removing several plugged resins.
Applications
・Removing permanent hole plugging ink.
・Leveling and removing build-up resin.
・Removing prepreg resin.
・Removing residual copper dust after plating.
・Removing the layer after black oxide treatment.
・Deburring after drilling.
・Surface grinding ceramic and stainless steel.

Features & Benefits
SPIRAL CUTTER, an elastic grinding wheel, is developed based on our know-how and advanced manufacturing technologies combined with coated and bonded abrasives. This advanced wheel consists of bonded abrasive elements on an elastic support. This contributes to fit well to a workpiece surfaces and provides excellent surface finish.
■ Removing and leveling various resin, such as hole plugging ink and build-up resin.
■ Excellent surface leveling and deburring on the surface of PCB.
■ Uniform surface finish without hole roll-off, grinding variation, and wild scratches.
■ Replacing with a new grinding belt after it is worn out, which contributes to a cost reduction and stable quality.
■ This wheel can be used like conventional buffs when mounting the wheel on a machinery or dressing the wheel.