Various types of non-woven abrasives, such as our SPIRAL
CUTTER, are used during each manufacturing process of PCB
Abrasives for PCB
Due to our advanced technology, our abrasives achieve high quality and long life.
In accompanying of densification and miniaturization of substrates, our abrasives are applied for polishing fine patterned substrates and multilayer substrates as well as single-sided substrate and double-sided substrate.
- Removing permanent hole plugging ink.
- Polishing SUS-made press plate
This elastic grinding wheel is developed based on our know-how and advanced manufacturing technologies combined with coated and bonded abrasives.
- Deburring after drilling. (before copper plating)
- Grinding prior to dry-film lamination.
Uniform surface finish without polishing variation and wild scratches.
Improved durability contributes to a cost reduction.
- Deburring after drilling. (before copper plating)
- Grinding prior to dry-film lamination
- Surface finishing prior to solder resist.
By employing ultra fine fibers thinly coated with resin bond realizes minifying of buff dust size and improves uniformity of abrasive coating.
This contributes to minimize clogging of holes and improve surface roughness, so that uniform surface finish without polishing variation and wild scratches can be obtained.
- Removing permanent hole plugging ink.
- Polishing SUS-made press plate
Due to high grinding ability, this wheel is suitable for removing hole plugging ink.
- Removing permanent hole plugging ink.
- Polishing SUS-made press plate.
VC WHEEL is a convolute wheel with grinding ability.
- Surface finishing prior to solder resist.
This wheel has the moderately flexible structure, which provides gentle cleaning action on the surface of PCB.
- Polishing SUS-made press plate
Due to high grinding ability and moderate flexibility, this wheel provides gentle cleaning action on the surface of PCB.