― Surface Grinding Wheels for Semiconductor Wafers？ ―
This wheel provides good surface finish on wafers
for semiconductor IC chip.
Due to our advanced vitrified bond technologies,
this vitrified bond diamond wheel provides strong abrasive holding strength,
and excellent grinding performance during grinding operations for various wafers.
Grinding operation of surface grinding wheel for semiconductor wafers
Grinding performance of surface grinding wheel for semiconductor wafers
Surface grinding wheel for semiconductor wafers (VDR)
Due to uniform distribution of micro diamond abrasives, this wheel offers less scratches.
【Features & Benefits】
Due to strong abrasives holding strength and high rigidity of vitrified bond wheel,mirror surface finish with high accuracy can be achieved.
And also, due to porous structure, this wheel offers free cutting.
Relative value using resinoid bond wheel (#3000) as a base of 100.