For semiconductor wafers
We have various grinding wheels for surface grinding, edge grinding,
notch grinding, and mirror finishing, etc. of semiconductor wafers.
Due to uniform distribution of micro diamond abrasives and strong abrasives holding strength, mirror surface finish with high accuracy can be achieved and this wheel offers free cutting.
These wheels specially designed with uniform structure offer high stock removal rate for wafers.
We have various grinding wheels for medium & large sized glass substrates,
and vehicle-mounted glasses.
Due to specially designed and advanced bond, this wheel can achieve longer profile holding and less chipping at high feed rate.
From high elastic modulus aiming at free cutting and severe dimensional tolerance of workpiece to low modulus for surface finish, wide option is available for various applications and needs.
Dressing of resin bond diamond / CBN wheels