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- Abrasives for Printed Circuit Board
・Deburring after drilling (before copper plating)
・Grinding prior to dry-film lamination.
・Surface finishing prior to solder resist.
Features & Benefits
By employing ultra fine fibers thinly coated with resin bond realizes minifying of buff dust size and improves uniformity of abrasive coating.
This contributes to minimize clogging of holes and improve surface roughness, so that uniform surface finish without polishing variation and wild scratches can be obtained.