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HSW WHEEL
- Abrasives for Printed Circuit Board
Applications
・Removing hole plugging ink.
・Removing build-up resin.
・Removing the layer after black oxide treatment.
・Polishing SUS-made press plate
Features & Benefits
■ HSW WHEEL has a flap structure reinforced by the resin impregnation.
■ This wheel shows high grinding ability and works effectively on removing resin.