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Edge Grinding Diamond Wheel for Wafers
・This wheel is suitable for edge grinding on silicon and other material’s wafers.
・Metal bond wheel is mainly used for rough grinding to get accurate edge profile.
・Resin bond wheel is mainly used for finish grinding to get good surface roughness.
・Wheel size and specification for various kinds of edge grinding machineries are available.
Features & Benefits
In edge grinding tighter profile tolerance and finer surface roughness are required, these wheels would satisfy these needs.
These wheels used advanced bond system are produced under high quality control system and high production technology.
These wheels specially designed with uniform structure offer high stock removal rate for wafers.
Diamond section of resin bond wheels and notched wheels do not contain the metallic materials caused to contamination.