Applications
・Surface grinding of silicon wafer
・Backgrinding
Surface Grinding Wheels for Various Wafers
BH7
Due to superior self-sharpening, this wheel offers free-cutting for hard-to-grind etched surface (after etching) of silicon wafer without dressing.
Due to advanced bond system and wheel design, this wheel provides long life with low power.
Features & Benefits
BH7
Due to superior self-sharpening, this wheel offers free-cutting for hard-to-grind etched surface (after etching) of silicon wafer without dressing.
Due to advanced bond system and wheel design, this wheel provides long life with low power.
Features & Benefits
BH14
By employing filler which can decrease grinding force and porous structure, this wheel offers high grinding performance with low power.
BH14 wheel offers good wafer surface quality with minute damages.
Features & Benefits
VDR
Due to uniform distribution of micro diamond abrasives, this wheel offers less scratches.
Due to strong abrasives holding strength and high rigidity of vitrified bond wheel, mirror surface finish with high accuracy can be achieved.
And also, due to porous structure, this wheel offers free cutting.
Applications
・Automobile parts
・Oil pump parts
・Compressor parts
・Miscellaneous
Features & Benefits
■ Due to our advanced bond system, this wheel can easily true the flatness of a grinding wheel with on-machine electro discharge truing, and also this wheel can reduce the amount of dimensional compensation during grinding, so that high accuracy in workpiece quality and longer wheel life can be offered.
Applications
・Automobile parts
・Oil pump parts
・Compressor parts
・Miscellaneous parts
Features & Benefits
■ Due to our advanced bond system and design, this wheel offers cool cutting at broad grinding area and high-accuracy and high efficiency grinding. Depending on applications, various types of wheel designs are available, such as two different grades inside and outside and additional slots.
■ Dressing interval extension can be achieved with low grinding force.
Case history
■ Grinding conditions
・Grinding mode ： Double disc surface grinding
・Wheel specification ： φ 585 × 195W × 2X CBN #120 −Resin
・Name of workpiece ： Valve adjusting shim
・Workpiece material ： SCM415
・Workpiece size ： φ 27 〜φ 40 × 3T
■ Results
・Surface roughness : Less than 1.6μmRz (ISO4287/1984)
・Flatness : Less than 5μm
・Long wheel life
■ Grinding conditions
・Grinding mode ： Double disc surface grinding
・Wheel specification ： φ 305 × 115W × 4X CBN#200 −Resin
・Name of workpiece ： Vanes
・Workpiece material ： SKH-51（HRc62）
・Workpiece size ： □ 20 〜30
■ Results
・Surface roughness : Less than 1.5μmRz (ISO4287/1984)
・Flatness : Less than 3μm
This wheel has longer wheel life compared with conventional wheel.
■ Grinding conditions
・Grinding mode ： Double disc surface grinding
・Wheel specification ： φ 305 × 50W × 3X CBN#120/325 −Resin
・Name of workpiece ： Cylinders
・Workpiece material ： FC-25
■ Results
Dressing interval extension and longer wheel life can be achieved.
Applications
・Double disc grinding for bearing and automobile parts
Features & Benefits
■Resinoid bond wheel
Double disc grinding has board area of contact with workpiece and between wheel faces, which causes heat generation.
Due to advanced filler and resinoid bond system, this wheel can prevent grinding burn and cracking with free-cutting.
■Epoxy bond wheel
By employing our advanced epoxy bond developed for high efficient grinding of unhardened steels, this wheel can achievehigh productivity and prevent grinding burn.
This wheel is suitable for grinding unhardened steels.
Applications
【SG、SGF】
- Precision grinding for unhardened and hardenedsteels,such as cast iron,carbon steels, alloysteels, and tool steels, etc.
【TG】
- Crank journal grinding, pin grinding
- Camprofile grinding
- Creepfeed grinding
- Tool and Toolroom grinding
Features & Benefits
SG abrasive
SG abrasive is high purity, ceramic aluminum oxide abrasive with a submicron crystalline structure deprived from a
seeded gel sintering process.
Due to superior hardness, strength, and fracture toughness to conventional fused aluminum oxide abrasive, SG abrasive provides excellent durability and high stock removal rate characteristics on the most demanding applications.
Selection of the bond type for SG abrasive ：
□VSG-1 is standard bond
□VSG-8 is designed for hard grade
□VSG-1R, and VSG-8R are designed for semi-porous wheel
□VSG-1P, and VSG-1P1 are designed for porous wheel
□VSGA3 is designed for high-porous wheel for creepfeed grinding
Products
News
Movie
Special
