Applications
・Grinding of bimetals (Tungsten carbide & Die steel)
・Grinding of bimaterials (Ceramics & Steel)
High-precision, high metal removal rate, and dressing interval extension can be achieved.
Features & Benefits
■ Productivity improvement
Low grinding force provides short cycle time and dressing interval extension.
■ Premium workpiece quality
Due to its continuous freeness of cut, this wheel can grind the surface of bimaterials with good flatness.
■ Durability improvement
Due to its strong abrasive holding strength, significant durability improvement compared with conventional one can be achieved.
Applications
・Grinding of sintered diamond and sintered CBN tools.
Features & Benefits
■ Grinding of PCD/PCBN tools with less chipping.
■ Suitable for continuous dress grinding.
Applications
・Tungsten carbide (drill, end mill)
Features & Benefits
■ Long wheel life at high metal removal rate
Due to heat resistance and advanced bond system, this wheel brings less wheel wear and longer wheel life at high metal removal rate.
■ Excellent corner holding
■ Stable grinding power
Applications
・This diamond wheel is designed as to meet various glass substrate specifications for FPD.
・This metal bond wheel is suitable for edge grinding on TFT glass and PDP (Plasma Display Panel).
・This resin bond wheel is suitable for chamfering electrode section of LCD panels and finish edge grinding.
Features & Benefits
■ Due to our advanced technology, this grinding wheel for LCD panel offers consistent quality.
■ This wheel offers high productivity and cost reduction.
■ Due to specially designed and advanced bond, this wheel can achieve longer profile holding and less chipping at high feed rate.
Applications
・This wheel is suitable for edge grinding on silicon and other material’s wafers.
・Metal bond wheel is mainly used for rough grinding to get accurate edge profile.
・Resin bond wheel is mainly used for finish grinding to get good surface roughness.
・Wheel size and specification for various kinds of edge grinding machineries are available.
Features & Benefits
In edge grinding tighter profile tolerance and finer surface roughness are required, these wheels would satisfy these needs.
These wheels used advanced bond system are produced under high quality control system and high production technology.
These wheels specially designed with uniform structure offer high stock removal rate for wafers.
Diamond section of resin bond wheels and notched wheels do not contain the metallic materials caused to contamination.
Applications
・Fine ceramics, such as Al2O3, SiC, Si3N4
・CFRP
・Bimaterials (Ceramics and steel)
・Silica glass
Features & Benefits
■ This wheel offers high accuracy, high grinding performance, and dressing interval extension.
■ Due to high rigidity and free-cutting of vitrified bond wheel, high accuracy can be achieved in bimaterial grinding.
Applications
・Surface grinding of silicon wafer
・Backgrinding
Surface Grinding Wheels for Various Wafers
BH7
Due to superior self-sharpening, this wheel offers free-cutting for hard-to-grind etched surface (after etching) of silicon wafer without dressing.
Due to advanced bond system and wheel design, this wheel provides long life with low power.
Features & Benefits
BH7
Due to superior self-sharpening, this wheel offers free-cutting for hard-to-grind etched surface (after etching) of silicon wafer without dressing.
Due to advanced bond system and wheel design, this wheel provides long life with low power.
Features & Benefits
BH14
By employing filler which can decrease grinding force and porous structure, this wheel offers high grinding performance with low power.
BH14 wheel offers good wafer surface quality with minute damages.
Features & Benefits
VDR
Due to uniform distribution of micro diamond abrasives, this wheel offers less scratches.
Due to strong abrasives holding strength and high rigidity of vitrified bond wheel, mirror surface finish with high accuracy can be achieved.
And also, due to porous structure, this wheel offers free cutting.
Applications
・Form grinding for tungsten carbide, and ceramics, etc.
Features & Benefits
■ It is possible to form wheel face by crushing roll
■ Free-cutting
■ Longer wheel life than conventional one
Applications
・Rough grinding focused on free-cutting
・Form grinding or cutting-off
・Internal grinding for small bore
Non-ferrous metal or non-ferrous metallic materials (ceramics, etc) : Electroplated diamond wheel
Features & Benefits
■ One-layered superabrasives (diamond) are fixed on steel core by electric plating method.
■ Due to its large protrusion height of abrasives, this wheel is suitable for rough grinding at high metal removal rate and precision grinding with free cutting.
■ Due to its high abrasive density, this wheel offers high wear resistance and low power consumption.
■ It is possible to make small-diameter wheels or complex shaped wheels as required.
Applications
・Rough and semi-finish grinding of soft materials without loading.
・Grinding of soft metals such as aluminum alloy, etc.
・Grinding of plastic
・Grinding of rubber
・Deburring and fettling of cast.
Features & Benefits
■ One-layered superabrasives (diamond) are brazed on steel core by metal bond.
■ Due to its strong abrasives holding strength, this wheel offers large protrusion height of abrasives, which contributes to high metal removal rate for soft metal materials without loading.
■ Abrasive density can be changed depending on various types of workpieces and applications.
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